| Characteristic Parameters | DVS-BCB | Epoxy Resin | PI |
| Dk（1 GHz） | 2.4 | 3.8~4.5 | 3.2~3.5 |
| Td | >350℃ | 150℃ | 260℃ |
| Water Absorption | <0.1% | 1.5%~3% | 1.2%~2% |
| Low curing temperature | 180℃ | 120~150℃ | 300℃ |
It can be used for the packaging between chips and substrates, wafer-level packaging, the fabrication of optoelectronic integrated chips, as a stress buffer layer, in the production of multi-chip modules and very large-scale integrated circuits, etc. More importantly, it can serve as a functional additive in the manufacturing process of BCB photoresists, and also act as an important additive for modifying polyimide 3D printing materials.
