Product Name: 4-Vinylbenzocyclobutene (abbreviated as 4-VBCB)
CAS No.: 99717-87-0
Molecular Formula: C₁₀H₁₀
Molecular Weight: 130.19 g/mol
Appearance: Colorless to pale yellow transparent liquid
Purity: ≥97% (HPLC)
Density: 0.962 g/cm³ (25°C)
Boiling Point: 75°C (0.6 hPa)
Refractive Index: n₂₀/D 1.578
Storage Conditions: Store at 2-8°C, protected from light and sealed under inert gas. Shelf life: 12 months.
Product Overview
4-VBCB is a high-performance bifunctional monomer whose molecular structure integrates a benzocyclobutene (BCB) ring and a vinyl (-CH=CH₂) group, featuring unique thermally induced ring-opening polymerization and free-radical polymerization properties. As a core derivative of the benzocyclobutene series, 4-VBCB is widely used in the synthesis of high-end electronic materials, and is particularly suitable for preparing low dielectric constant (low-k) thermosetting resins.
Main Applications
- Electronic Packaging & PCB: Used in M9-grade hydrocarbon resins (e.g., poly(4-VBCB) or blends with DVS-BCB), it is applicable to PCBs of AI servers, high-frequency 5G base stations and data centers, providing excellent signal integrity and thermal stability.
- Microelectronic Materials: As a dielectric layer monomer, it supports low-loss (Df<0.0012) insulating films, meeting the high power density requirements of platforms such as Rubin.
- High-performance Composite Materials: It forms a cross-linked network via Diels-Alder reaction, and is applied in aerospace and flexible electronics fields.
Performance Advantages
- Low Dielectric Properties: The cured product has a Dk of 2.40-2.65 and Df of 0.0008-0.0012, outperforming traditional silicone-based BCB.
- Thermomechanical Stability: With Tg >295°C, Td >466°C, CTE of 45-55 ppm/°C and moisture absorption rate <0.15%, it exhibits excellent environmental adaptability.
- Mechanical Toughness: It has a tensile strength of 85-110 MPa and an elongation at break of 8-15%, achieving a 100% improvement in toughness. Meanwhile, its adhesion is increased by over 30%, effectively reducing processing defects.
- Process Compatibility: It enables catalyst-free thermal curing with a wide processing window (>40°C) and gel time of 8-12 min, which is suitable for large-scale production.
