This dry-etchable benzocyclobutene (BCB) resin is a next-generation, high-performance material for electronic packaging. It delivers an exceptional combination of low dielectric constant, excellent film-forming capability, high thermal stability, and superior adhesion. As a critical low-k dielectric and interlayer insulation material, it is engineered to meet the demanding requirements of advanced microelectronics, including integrated circuits and high-speed communication devices
