Benzocyclobutene, with a molecular formula of C₈H₈, is a new generation of high-performance, low-dielectric electronic packaging materials. BCB series materials boast excellent electrical properties and water absorption, and their dielectric constants and dielectric loss factors remain stable over a wide range of temperatures and frequencies. The cured resin has a high internal crosslinking density, thus exhibiting a high glass transition temperature, good thermal stability, and outstanding chemical resistance. Meanwhile, they also have the advantages of low resin viscosity and low curing temperature.
